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Millimeter-Scale, Micro-Electro- Mechanical Systems Gas Turbine Engines

机译:毫米级微机电系统燃气轮机发动机

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The confluence of market demand for greatly improved compact power sources for portable electronics with the rapidly expanding capability of micromachining technology has made feasible the development of gas turbines in the millimeter-size range. With airfoil spans measured in 100's of microns rather than meters, these "microengines" have about 1 millionth the air flow of large gas turbines and thus should produce about one millionth the power, 10- 100 W. Based on semiconductor industry-derived processing of materials such as silicon and silicon carbide to submicron accuracy, such devices are known as micro-electro-mechanical systems (MEMS). Current millimeter-scale designs use centrifugal turbomachinery with pressure ratios in the range of 2:1 to 4:1 and turbine inlet temperatures of 1200-1600 K. The projected performance of these engines are on a par with gas turbines of the 1940s. The thermodynamics of MEMS gas turbines are the same as those for large engines but the mechanics differ due to scaling considerations and manufacturing constraints. The principal challenge is to arrive at a design which meets the thermodynamic and component functional requirements while staying within the realm of realizable micromachining technology. This paper reviews the state of the art of millimeter-size gas turbine engines, including system design and integration, manufacturing, materials, component design, accessories, applications, and economics. It discusses the underlying technical issues, reviews current design approaches, and discusses future development and applications.
机译:市场需求对便携式电子设备极大地改进的紧凑型电源以及微加工技术的迅速扩展的汇聚使得开发毫米尺寸范围的燃气轮机成为可能。这些翼片的跨度以100微米而不是米为单位进行测量,因此,它们的大型燃气轮机的空气流量约为百万分之一,因此应产生的功率约为100-100 W的百万分之一。诸如硅和碳化硅之类的材料达到亚微米精度,这种设备被称为微机电系统(MEMS)。当前的毫米级设计使用压力比在2:1至4:1范围内且涡轮入口温度为1200-1600 K的离心式涡轮机械。这些发动机的预期性能与1940年代的燃气涡轮机相当。 MEMS燃气轮机的热力学与大型发动机的热力学相同,但由于比例考虑和制造限制,其机械原理不同。主要的挑战是要在满足可热力学和部件功能要求的同时又要在可实现的微加工技术领域内实现设计。本文回顾了毫米燃气涡轮发动机的最新技术水平,包括系统设计和集成,制造,材料,组件设计,附件,应用和经济性。它讨论了潜在的技术问题,回顾了当前的设计方法,并讨论了未来的开发和应用。

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