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机译:电力电子应用中用作热界面材料的Sn-Bi焊膏的热阻分析
State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China;
Institute of Microelectronics, Tsinghua University, Tsinghua National Laboratory for Information Science and Technology, Beijing 100084, China;
Institute of Microelectronics, Tsinghua University, Beijing 100084, China;
Institute of Microelectronics, Tsinghua University, Beijing 100084, China;
Institute of Microelectronics, Tsinghua University, Beijing 100084, China;
City Key Laboratory of Thermal Management Engineering and Materials, Graduate School at Shenzhen, Tsinghua University, Shenzhen City, Guangdong Province 518055, China;
State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China;
thermal interface material; thermal resistance; Sn-Bi solder paste; scanning acoustic microscopy; laser flash;
机译:用于电力电子应用的具有超低热阻的基于银纳米粒子的热界面材料
机译:三维空隙形态对焊料热界面材料热阻影响的计算研究
机译:用于高温电力电子应用的热界面材料的降解
机译:在电子冷却应用中的热界面材料的散装热导率和接口接触电阻效应
机译:用于电子应用的下一代热界面材料的合成,生产和表征
机译:新型电阻测量方法:精度和热依赖性分析及其在纤维材料中的应用
机译:用于高功率电子产品的非污垢石墨烯热界面材料:最小化热接触电阻
机译:用于电力电子应用的热界面材料