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Electron Cyclotron Resonance Plasma Preparation of CdZnTe (211 )B Surfaces for HgCdTe Molecular Beam Epitaxy

机译:HgCdTe分子束外延的CdZnTe(211)B表面电子回旋共振等离子体制备

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CdZnTe wafers were inserted into a multi-chamber processing facility without prior preparation, cleaned by exposure to an electron cyclotron resonance Ar/H, plasma, and used as substrates for molecular beam epitaxy of HgCdTe. Changes induced in the wafer near-surface region during the cleaning step were moni- tored using in situ spectroscopic ellipsometry. Ellipsometric data were subse- quently modeled to provide the time evolution of the thickness of a native overlayer. Auger electron spectra were consistent with surfaces free of residual contamination and which had the stoichiometry of the underlying bulk. Surface roughness values of 0.4 nm were obtained ex situ using interferometric micros- copy. Electron diffraction patterns of plasma prepared wafers heated to 185℃ (the temperature required for HgCdTe molecular beam epitaxy) were streaked. Structural and electrical characteristics of epilayers grown on these substrates were found to be comparable to those deposited on wafers prepared using a conventional wet chemical process. This demonstrates an important step in an all-vacuum approach to HgCdTe detector fabrication.
机译:CdZnTe晶片无需事先准备即可插入多室处理设备,通过暴露于电子回旋共振Ar / H,等离子体进行清洗,并用作HgCdTe分子束外延的衬底。使用原位光谱椭偏仪监测清洗步骤期间在晶片近表面区域引起的变化。随后对椭偏数据进行建模,以提供原生覆盖层厚度随时间的变化。俄歇电子能谱与没有残留污染物的表面一致,并且其化学计量与下面的堆积物有关。使用干涉显微技术非原位获得0.4 nm的表面粗糙度值。对加热到185℃(HgCdTe分子束外延所需的温度)的等离子处理晶片的电子衍射图进行划线。发现在这些衬底上生长的外延层的结构和电学特性与使用常规湿化学工艺制备的晶片上沉积的外延层的结构和电学特性相当。这证明了在全真空方法中制造HgCdTe检测器的重要一步。

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