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Measurement of Minority Carrier Lifetime in n-Type MBE HgCdTe and Its Dependence on Annealing

机译:n型MBE HgCdTe中少数载流子寿命的测量及其对退火的依赖性

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摘要

Results are presented for minority carrier lifetime in n-type molecular beam epitaxy Hg_1-xCd_xTe with x ranging from 0.2 to 0.6. It was found that the lifetime was unintentionally degraded by post-growth annealing under Hg saturated conditions in a H, atmosphere that was both time and temperature dependent. This effect was minimal or non-existent for x~0.2 material, but very strong for × 2 0.3. Hydrogen was identified as responsible for this degradation. Identical annealing in a He atmosphere avoids this degradation and results in near- theoretical lifetime values for carrier concentrations as low 1 × 10~15 cm~-3 in 20.3 material. Modeling was carried out for x~0.2 and x~0.4 material that shows the extent to which lifetime is reduced by Shockley-Real-Hall recombination for carrier concentrations below 1 × 10~15 cm~-3, as well as for layers annealed in H_2. It appears that annealing in H_2 results in a deep recombination center in Wider bandgap HgCdTe that lowers the lifetime without affecting the majority carrier concentration and mobility.
机译:给出了n型分子束外延Hg_1-xCd_xTe中少数载流子寿命的结果,x的范围为0.2到0.6。已发现,在Hg气氛下,在Hg饱和条件下,生长后退火会随时间和温度而无意中降低了寿命。对于x〜0.2的材料,此影响很小或不存在,但对于×2 0.3的效果非常强。氢气被认为是造成这种降解的原因。在He气氛中进行相同的退火可避免这种降解,并在20.3材料中对于低1×10〜15 cm〜-3的载流子浓度产生接近理论寿命的值。对x〜0.2和x〜0.4的材料进行了建模,显示了对于浓度低于1×10〜15 cm〜-3的载流子,Shockley-Real-Hall重组降低了寿命,在此条件下退火的层H_2。看来,在H_2中进行退火会导致宽带隙HgCdTe中的复合中心变深,从而降低了寿命,却不影响大多数载流子浓度和迁移率。

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