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机译:热循环对Sn-Ag-Cu焊点和板级跌落可靠性的影响
School of Mechanical ampamp Aerospace Engineering Nanyang Technological University 50 Nanyang Avenue Singapore 639798 Singapore;
School of Mechanical ampamp Aerospace Engineering Nanyang Technological University 50 Nanyang Avenue Singapore 639798 Singapore;
School of Mechanical ampamp Aerospace Engineering Nanyang Technological University 50 Nanyang Avenue Singapore 639798 Singapore;
Drop impact; thermal cycling; intermetallic compound; Kirkendall void; Pb-free solder; ball grid array;
机译:热循环对Sn-Ag-Cu焊点和板级跌落可靠性的影响
机译:低温焊接SN-AG-CU / SN-Bi-X混合BGA焊点用于消费电子产品的板级降低性和断裂行为
机译:微量合金元素对低银Sn-Ag-Cu焊点热循环和跌落冲击可靠性的影响
机译:在电路板级跌落和温度循环测试条件下,针对五种基体焊盘光洁度共同设计焊点可靠性的研究
机译:锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响,包括混合焊点在等温老化下的微观结构变化
机译:随机空隙的产生以及热冲击载荷对发光二极管倒装芯片焊点机械可靠性的影响
机译:用于SN-AG-Cu无铅焊点的热疲劳寿命模拟