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Analysis of types of residual dislocations in the VGF grwoh of GaAs with ekxtremely low dislocation density (EPD1000 cm~-2)

机译:极低位错密度(EPD 1000 cm〜-2)的GaAs的VGF生长区中的残留位错类型分析

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摘要

GaAs single crystals (silicon-doped, 2 inch) with extremely low dislocation densities (etch pit density (EPD) 5-100 cm~-2 were grown by the vertical gradient freeze method. In these crystals we characterised different types of dislocations by the aid of white beam X-ray diffraction topography and infrared transmission microscopy. It was found for decreasing disloction densioties (EPD<200 cm~-2), that dislocations having a lien vector l, Which is parallel to the [0 0 1] growth direction of the crystals, become more and more domainant. These residual disloctions are induced by the seeding process (so far we were using LEC-grwn seed crystals). These residual dislocations cannot are induced by the seeding process (so far we were using LEC-grown seed crystals). These residual disloctions cannot be avoided by minimising the thermal stress during the crystal growth process.
机译:通过垂直梯度冷冻法生长出位错密度极低(蚀刻坑密度(EPD)为5-100 cm〜-2)的GaAs单晶(硅掺杂2英寸),在这些晶体中,我们通过晶格表征了不同类型的位错借助白光束X射线衍射形貌和红外透射显微镜,发现降低位错密度(EPD <200 cm〜-2)的位错具有留置向量l,该向量与[0 0 1]生长平行这些残留的位错是由晶种形成的(到目前为止,我们使用的是LEC生长的籽晶),这些残留的位错是不能由晶种形成的(到目前为止,我们使用的是LEC) (生长的种晶)。通过在晶体生长过程中最小化热应力,无法避免这些残余位移。

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