首页> 外文期刊>Journal of Crystal Growth >Characteristics of GaN/Si(1 1 1) epitaxy grown using Al_0.1Ga_0.9N/AlN composite nucleation layers having different thicknesses of AlN
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Characteristics of GaN/Si(1 1 1) epitaxy grown using Al_0.1Ga_0.9N/AlN composite nucleation layers having different thicknesses of AlN

机译:使用具有不同厚度的AlN的Al_0.1Ga_0.9N / AlN复合成核层生长的GaN / Si(1 1 1)外延特性

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摘要

We have studied the effects of Al_0.1Ga_0.9N(150 nm)/AlN composite nucleation layers (CNLs) having different thicknesses of AlN ranging from 20 to 41 nm on the growth characteristics of GaN/Si(1 1 1) epitaxy. The surface morphology of the GaN epitaxial layers which were grown on Al_0.1Ga_0.9N(150 nm)/AlN CNLs showed that the number of thermal etch pits and cracks were abruptly decreased with the increase of AlN thickness from 20 to 35 nm. However, the morphology of GaN epitaxy which was grown on Al_0.1Ga_0.9N(150 nm)/AlN CNL having AlN of thickness 41 nm above 35 nm showed that the number of etch pits increased again.
机译:我们已经研究了Al_0.1Ga_0.9N(150 nm)/ AlN复合成核层(CNLs)具有不同的厚度范围从20到41 nm的AlN对GaN / Si(1 1 1)外延生长特性的影响。在Al_0.1Ga_0.9N(150 nm)/ AlN CNL上生长的GaN外延层的表面形貌表明,随着AlN厚度从20 nm增加到35 nm,热刻蚀坑和裂纹的数量急剧减少。然而,在具有大于35nm的厚度的41nm的AlN的Al_0.1Ga_0.9N(150nm)/ AlN CNL上生长的GaN外延的形态表明,蚀刻凹坑的数量再次增加。

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