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首页> 外文期刊>Journal of Computational Electronics >Asymmetric dual-k spacer trigate FinFET for enhanced analog/RF performance
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Asymmetric dual-k spacer trigate FinFET for enhanced analog/RF performance

机译:非对称双k间隔三栅极FinFET,可增强模拟/ RF性能

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In this paper, we aim to explore the potential benefits of using source side only dual-k spacer (Dual-kS) trigate FinFET structure to improve the analog/RF figure of merit (FOM) for low power operation at 20 nm gate length. It has been observed from the results that Dual-kS (inner spacer high-k) FinFET structure improves the coupling of the gate fringe field to the underlap region towards the source side and results into improvement in transconductance (g(m)) and output conductance (g(ds)). It was also found that drain side only dual-k spacer (Dual-kD) improves the coupling of the gate fringe field to the underlap region towards the drain side which helps to shift away the drain field from gate edge and results into improvement in output conductance (g(ds)) only at the cost of increase in Miller capacitance. A comparative simulation study has been performed on four different device structures namely both side low-k spacers (conventional), both side dual-k spacer (Dual-kB), Dual-kD and Dual-kS structures. From the simulation study, it was found that that Dual-kS structure has potential to improve g(m) by similar to 8.7 %, g(ds) by similar to 32.24 %, intrinsic gain (A(V0)) by similar to 11.44 %, early voltage (V-EA) by similar to 47.59 %, maximum oscillation frequency (f(MAX)) by similar to 1.7 % and the ratio of gate-source capacitance and gate-drain capacitance (C-gs/C-gd) by similar to 15.27 % with a slight reduction in the value of unity gain cut-off frequency (f(T)) by similar to 0.58 % in comparison to the conventional structure at drain current (I-ds) of 10 mu A/mu m. Furthermore, to reduce the drain field influence on the channel region, we also studied the effect of asymmetric drain extension length on Dual-kS FinFET structure.
机译:在本文中,我们旨在探讨使用仅源侧双k间隔(Dual-kS)三栅FinFET结构为20 nm栅极长度下的低功耗操作提高模拟/ RF品质因数(FOM)的潜在好处。从结果可以看出,双kS(内部间隔高k)FinFET结构改善了栅极边缘场到源极侧的下重叠区的耦合,并导致跨导(g(m))和输出的改善。电导(g(ds))。还发现仅漏极侧的双k隔离层(Dual-kD)改善了栅极边缘场与下叠层区域向漏极侧的耦合,这有助于将漏极场从栅极边缘移开,从而改善了输出电导(g(ds))仅以增加米勒电容为代价。已经对四种不同的器件结构进行了比较仿真研究,即两侧的低k隔离物(常规),两侧的双k隔离物(Dual-kB),Dual-kD和Dual-kS结构。从仿真研究中发现,Dual-kS结构具有将g(m)提高约8.7%,将g(ds)提高约32.24%,将固有增益(A(V0))提高约11.44的潜力。 %,早期电压(V-EA)约47.59%,最大振荡频率(f(MAX))约1.7%,栅源电容与栅漏电容之比(C-gs / C-gd )降低了15.27%,与传统结构在10μA / A的漏极电流(I-ds)下相比,单位增益截止频率(f(T))的值略微降低了0.58%%亩此外,为了减少漏极场对沟道区的影响,我们还研究了不对称漏极延伸长度对Dual-kS FinFET结构的影响。

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