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首页> 外文期刊>Journal of Computational Electronics >Simulation of thin-TFETs using transition metal dichalcogenides: effect of material parameters, gate dielectric on electrostatic device performance
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Simulation of thin-TFETs using transition metal dichalcogenides: effect of material parameters, gate dielectric on electrostatic device performance

机译:使用过渡金属二硫化碳对薄TFET的仿真:材料参数,栅极电介质对静电器件性能的影响

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In recent years, significant of scientific research effort has focused on the investigation of transition metal dichalcogenides (TMDC) and other two-dimensional (2D) materials like graphene or boron nitride. Theoretical investigation on the physical aspects of these materials has revealed a whole new range of exciting applications due to wide tunability in electronic and optoelectronic properties. Besides theoretical exploration, these materials have been successfully implemented in electronic and optoelectronic devices with promising results. In thiswork, we have investigated the effect of monolayer TMDC materials and monolayer TMDC alloys on the performance of thin tunneling field-effect transistors or thin-TFETs. These are promising electronic devices that can achieve steep switching characteristics. We have used the self-consistent determination of the conduction and valence band levels in the device and a simplified model of interlayer tunneling current reported in recent literature that treats scattering semiclassically and incorporates the energy broadening effect using a Gaussian approximation. We have also explored the effect of gate dielectric material variation, interlayer dielectric variation, top gatemetalworkfunction on the performance of the device. Our study shows that proper choice of material in the top and bottom layers, optimization of materials used as gate and interlayer dielectric are necessary to extract the full potential of these devices. The electron affinity and bandgap of the TMDCs used in different layers effectively control the threshold voltage and current in the device. As seen from our simulation, interlayer materials with high dielectric constant can degrade subthreshold device performance, increase threshold voltage, whereas lowering interlayer thickness could increase device 'on' current at the expense of degraded subthreshold performance.
机译:近年来,大量科学研究工作集中在过渡金属二卤化碳(TMDC)和其他二维(2D)材料(例如石墨烯或氮化硼)的研究上。对这些材料的物理方面进行的理论研究表明,由于电子和光电特性的广泛可调性,全新的令人兴奋的应用范围。除了理论上的探索之外,这些材料已经成功地应用于电子和光电设备中,并取得了可喜的成果。在这项工作中,我们研究了单层TMDC材料和单层TMDC合金对薄隧道效应晶体管或TFET的性能的影响。这些是有望实现陡峭开关特性的有前途的电子设备。我们使用了器件中导带和价带能级的自洽确定方法以及最近文献中报道的层间隧穿电流的简化模型,该模型对散射进行了半经典处理,并采用了高斯近似方法并入了能量扩展效应。我们还探讨了栅极电介质材料变化,层间电介质变化,顶部栅极金属功函数对器件性能的影响。我们的研究表明,要充分利用这些器件的潜力,必须适当选择顶层和底层的材料,优化用作栅极和层间电介质的材料。在不同层中使用的TMDC的电子亲和力和带隙可有效控制器件中的阈值电压和电流。从我们的仿真中可以看出,具有高介电常数的夹层材料会降低亚阈值器件的性能,增加阈值电压,而降低夹层厚度可能会增加器件的“导通”电流,但会降低亚阈值性能。

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