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FAULT DETECTION FOR THE CLASS IMBALANCE PROBLEM IN SEMICONDUCTOR MANUFACTURING PROCESSES

机译:半导体制造过程中的类不平衡问题的故障检测

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In the semiconductor manufacturing process, fault detection which aims at constructing a decision tool to maintain high process yields is a major step of the process control. Unfortunately, the class imbalance in the modern semiconductor industry makes feature selection for fault detection quite challenging. However, the characteristic has usually been ignored in the open literatures. This paper analyzes the challenge and indicates some of the reasons are due to the dataset shift, the small samples and the class overlapping caused by the class imbalance. To cope with the problems, a new feature selection approach is proposed, which combines the global and local resampling and named ensemble manifold sensitive margin fisher analysis (EMSMFA). Our approach consists of three key components: (1) At the global level, the bagging-based ensemble model is used to overcome the overfitting caused by the data shift; (2) At the local level, the manifold-based oversampling named the weighted synthetic minority oversampling technique (WSMOTE) is proposed to solve the small samples problem in the minority class; (3) The sensitive margin fisher analysis (SMFA) is used to solve the challenge caused by the class overlapping. The proposed fault detection method is demonstrated through its application to the semiconductor wafer fabrication process. The experimental results confirm the EMSMFA improves the performance of fault detection.
机译:在半导体制造过程中,旨在构造决策工具以保持高过程成品率的故障检测是过程控制的主要步骤。不幸的是,现代半导体工业中的类不平衡使得用于故障检测的特征选择非常具有挑战性。然而,该特征通常在公开文献中被忽略。本文分析了这一挑战,并指出了某些原因,这是由于数据集移位,小样本以及类不平衡导致的类重叠。为了解决这些问题,提出了一种新的特征选择方法,该方法结合了全局和局部重采样以及命名的集成流形敏感边缘费舍尔分析(EMSMFA)。我们的方法包括三个关键部分:(1)在全球范围内,基于装袋的集成模型用于克服由数据移位引起的过度拟合; (2)在地方一级,提出了基于流形的过采样方法,称为加权合成少数过采样技术(WSMOTE),以解决少数群体中的小样本问题; (3)敏感边缘费舍尔分析(SMFA)用于解决类重叠造成的挑战。通过将其应用于半导体晶圆制造工艺中,证明了所提出的故障检测方法。实验结果证实了EMSMFA可以提高故障检测的性能。

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