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Novel Fault Detection and Classification Method for High-Mix Semiconductor Manufacturing Processes - (PPT)

机译:高混合半导体制造工艺的新型故障检测与分类方法 - (PPT)

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According to the customer's various needs and the shrinking design rules for any device, it has been required to control process tools with too many input parameters, in order to cope with the more complicated formulas for high-mix manufacturing. In this paper, "Multiple SPC" is proposed as a new fault detection and classification (FDC) solution that can control the highly advanced tools in the nano-scale age. Multiple SPC is composed of three parts: (i) univariate SPC with control limits, robust enough to handle the frequent changes for tool maintenance and generic enough such that it is possible to normalize the input parameters, (ii) multivariate SPC with an integrated index correlating to the normalized parameters in part (i), and (iii) fault classification for classifying fault types with the patterns of the correlated parameters. The proposed method which covers the recipes (formulas) of various design rule from 130 to 65 nm, was tested by in an application to the plasma etcher.
机译:根据客户的各种需求和任何设备的缩小设计规则,需要使用太多输入参数控制工艺工具,以应对高混合制造的更复杂的公式。在本文中,“多个SPC”被提出为新的故障检测和分类(FDC)解决方案,可以控制纳米级年龄的高度高级工具。多个SPC由三个部分组成:(i)具有控制限制的单变频SPC,足以处理工具维护和通用的频繁更改,使得可以将输入参数(ii)与集成索引的多变量SPC标准化与部分(i)的归一化参数相关联,(iii)故障分类,用于将故障类型与相关参数的模式进行分类。通过在施加到等离子体蚀刻器的应用中测试了覆盖各种设计规则的配方(公式)的所提出的方法。

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