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Properties of hydrogenated amorphous silicon prepared by chemical vapor deposition

机译:化学气相沉积制备的氢化非晶硅的性质

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Hydrogenated amorphous silicon (a‐Si:H) films were prepared by chemical vapor deposition (CVD) from mixtures of silane, disilane, trisilane, and higher polysilanes in hydrogen carrier gas at 1 atm total pressure, at substrate temperatures from 420–530 °C. Experimental parameters are explained and properties as a function of these parameters are shown. The measurements include hydrogen content (by IR), optical, electrical, and photovoltaic properties of the material. In most respects, the CVD material closely resembles the a‐Si:H usually prepared by glow discharge. The following differences have been noted: (1) the CVD a‐Si:H shows no IR absorption at 840–850 cm-1, which is consistent with the expected better thermal stability of the CVD material because of the much higher substrate temperatures in the CVD process than in the glow discharge process. (2) The band gap of CVD a‐Si:H is lower by about 0.1 eV than glow discharge a‐Si:H of the same hydrogen content. Thus, the band gap of CVD a‐Si:H is better matched to the solar spectrum than is glow discharge a‐Si:H. (3) All three IR absorption bands due to hydrogen are about 20% narrower in the CVD a‐Si:H, suggesting a simpler structure. (4) The temperature dependence of the dark conductivity of CVD a‐Si:H fits a curve for a single activation energy, in contrast to the more complicated temperature dependence often found in glow discharge a‐Si:H, in which two different activation energies are seen at high and low temperatures. This suggests that the conduction mechanism is also simpler in the CVD a‐Si:H. (5) The growth rates of good‐quality CVD films are much higher (up to about 100 Å/s) than are typical of the glow discharge method.
机译:氢化非晶硅(a-Si:H)膜是通过化学气相沉积(CVD)由硅烷,乙硅烷,丙硅烷和高级聚硅烷在氢气载气中的混合物在总压力为1 atm的条件下于420–530°的温度下制备的C。解释了实验参数,并显示了作为这些参数的函数的特性。测量包括氢含量(通过红外),材料的光学,电和光伏特性。在大多数方面,CVD材料与通常通过辉光放电制备的a-Si:H非常相似。注意到以下差异:(1)CVD a-Si:H在840-850 cm-1处没有显示IR吸收,这与预期的CVD材料更好的热稳定性相一致,因为衬底的温度要高得多。 CVD工艺要比辉光放电工艺好。 (2)CVD a-Si:H的带隙比相同氢含量的辉光放电a-Si:H的带隙低约0.1 eV。因此,与辉光放电a-Si:H相比,CVD a-Si:H的带隙与太阳光谱更匹配。 (3)由于氢导致的所有三个IR吸收带在CVD a-Si:H中窄约20%,表明结构更简单。 (4)CVD a-Si:H的暗电导率的温度依赖性适合单一活化能的曲线,这与辉光放电a-Si:H中经常发现的更复杂的温度依赖性不同,辉光放电中的两种不同活化在高温和低温下都能看到能量。这表明在CVD a-Si:H中,传导机理也更简单。 (5)高质量CVD膜的生长速率比辉光放电方法的典型生长速率高得多(高达100Å/ s)。

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    《Journal of Applied Physics 》 |1984年第12期| P.4309-4317| 共9页
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  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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