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首页> 外文期刊>Journal of Applied Physics >In-plane refractive-index anisotropy in porous silicon layers induced by polarized illumination during electrochemical etching
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In-plane refractive-index anisotropy in porous silicon layers induced by polarized illumination during electrochemical etching

机译:电化学蚀刻过程中极化照明在多孔硅层中引起的面内折射率各向异性

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Porous silicon (PSi) layers have been anodically etched under polarized illumination, and the degree of linear polarization of their photoluminescence (PL) was measured. The etching conditions were chosen such that the resulting PSi layers were thin enough for interference fringes to appear in their PL spectra. Experimental results show a sinusoidal variation in the degree of linear polarization as a function of the emission photon energy. The amplitude and phase of the sinusoidal variation depend largely on the polarization direction of the excitation light. These observations give strong evidence that there is a significant in-plane anisotropy of the refractive indices for these PSi samples. Values ranging from 0.1% to 0.67% have been obtained for the magnitude of the birefringence. The maximum refractive index is obtained when the excitation-light polarization direction is perpendicular to that of the polarized illumination used during etching. This can be explained by assuming that the polarized photoelectrochemical etching causes the Si structures to be thinner in the polarization direction. (C) 2004 American Institute of Physics.
机译:多孔硅(PSi)层已在偏振照明下进行阳极蚀刻,并测量了其光致发光(PL)的线性偏振度。选择蚀刻条件,使得所得的PSi层足够薄,以使干涉条纹出现在其PL光谱中。实验结果表明线性极化程度的正弦变化是发射光子能量的函数。正弦变化的幅度和相位在很大程度上取决于激发光的偏振方向。这些观察结果提供了有力的证据,表明这些PSi样品的折射率存在明显的面内各向异性。对于双折射的大小,已经获得了从0.1%到0.67%的值。当激发光偏振方向垂直于蚀刻期间使用的偏振照明的偏振方向时,可获得最大折射率。这可以通过假设偏振光电化学蚀刻使Si结构在偏振方向上变薄来解释。 (C)2004美国物理研究所。

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