首页> 外文期刊>Journal of Applied Physics >Analyses of the work required to delaminate a coating film from a substrate under oscillating load conditions and the film-substrate contact behavior after delamination
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Analyses of the work required to delaminate a coating film from a substrate under oscillating load conditions and the film-substrate contact behavior after delamination

机译:分析在振动载荷条件下将涂膜从基材上剥离所需的功以及剥离后薄膜与基材的接触行为

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Nanoindentation tests in which oscillating loads were applied to specimens were carried out to study the work (W_f) required for a coating film to delaminate from its substrate. A sharp increase in the indentation depth occurred during coating film delamination. A theoretical model was developed for the present study to evaluate the difference between the work in the load-depth profiles obtained with and without delamination. Arranging that the maximum load was reached at the end of the loading process allowed us to obtain an approximately constant value for the indentation depth propagation rate during in one cycle. This allowed a determination of the number of oscillating cycles and, thus, the work required by assuming that there was no delamination during this delamination period. The depth propagation rates and the work required for coating film delamination were investigated by varying P_(max), P_(mean), P_0, and frequency (f). The depth propagation rates were slightly increased by increasing the P_(max) value but were significantly lowered by increasing the frequency (f). The effects due to the changes in P_(mean) and P_0 on the depth propagation rate were insignificant. The W_f value was slightly lowered by increasing the P_(max) value but was significantly increased by increasing the oscillating load frequency (f). The effects of varying P_0 and P_(mean) on the W_f value were found to be small. The W_f values showed an exponential drop when the depth propagation rate was increased; they were asymptotic to a constant value when the depth propagation rate was sufficiently high. Coating film delamination produced a sharp increase in the indentation depth even in the case of a very small load increase. The oscillating load-depth cycles appearing after delamination allowed us to establish the film-substrate contact behavior occurring during the loading/unloading process of one oscillating cycle.
机译:进行了对样品施加振荡载荷的纳米压痕测试,以研究涂膜从其基材上剥离所需的功(W_f)。在涂膜分层期间压痕深度急剧增加。为本研究开发了一个理论模型,以评估在进行分层和不进行分层的情况下所获得的载荷-深度剖面之间的差异。安排在加载过程结束时达到最大载荷,使我们可以在一个周期内获得压痕深度传播速率的近似恒定值。这样就可以确定振荡周期的数量,并由此确定所需的工作,方法是假设在该分层期间没有分层。通过改变P_(max),P_(mean),P_0和频率(f)研究了深度传播速率和涂膜分层所需的功。通过增加P_(max)值可以略微增加深度传播速率,但是通过增加频率(f)可以显着降低深度传播速率。 P_(mean)和P_0的变化对深度传播速率的影响不明显。通过增加P_(max)值可以稍微降低W_f值,但是通过增加振荡负载频率(f)可以显着提高W_f值。发现改变P_0和P_(平均值)对W_f值的影响很小。当深度传播速率增加时,W_f值显示出指数下降。当深度传播速率足够高时,它们渐近至恒定值。即使在很小的载荷增加的情况下,涂膜分层也会使压痕深度急剧增加。分层后出现的振荡载荷深度循环使我们能够确定在一个振荡循环的加载/卸载过程中发生的薄膜与基材的接触行为。

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