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Measurement of elastic response and delamination behavior of thin film-substrate system by a shaft-loaded blister test

机译:通过轴装泡罩测试测量薄膜基板系统的弹性响应和分层行为

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We present a theoretical study of the constitutive relation for the shaft-loaded blister configuration in the presence of tensile residual stress. The relationships among strain energy release rate, load, deflection and residual stress are fully investigated. A series of numerical simulation and experiments allow us to verify the theory quantitatively which ought to have significant implications in many technological situations.
机译:我们在存在拉伸残余应力存在下,对轴装的泡罩构型构成关系的理论研究。完全研究应变能释放速率,负荷,偏转和残余应力之间的关系。一系列数值模拟和实验允许我们定量验证理论,这应该在许多技术情况下具有重大影响。

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