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Pressure dependence of SiO_2 growth kinetics and electrical properties on SiC

机译:SiO_2的生长动力学和电学性质对SiC的压力依赖性

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Dry oxidations between 0.25 and 4 atm at 1150 ℃ are used to characterize the pressure dependence of the growth kinetics of SiO_2 along three orientations of the 4H-SiC polytype. The growth curves are studied using the Deal-Grove model. The extracted linear and parabolic constants are found to scale linearly with the pressure up to 2 atm. However, the data indicate that the (0001) Si-face exhibits a retarded growth rate above 2 atm. It is also found that, like Si, there is a critical oxide thickness below which the linear-parabolic model cannot be applied. This value is found to be between 36 and 40 nm for SiO_2 on 4H-SiC, and is apparently independent of the crystal orientation and oxidation pressure. The extracted critical thickness and its properties are similar to what is observed on Si, suggesting that the fast growth regime is dictated by the nature of the oxide. Finally, it is shown that the density of interface states (D_(it)) on the (0001) Si-face is not reduced by faster oxide growth rates within the monitored energy window.
机译:在1150℃下0.25〜4 atm的干式氧化用于表征SiO_2沿4H-SiC多型体的三个取向的生长动力学的压力依赖性。使用Deal-Grove模型研究增长曲线。发现提取的线性和抛物线常数与压力最大为2 atm时呈线性比例关系。然而,数据表明(0001)Si面在2atm以上显示出延迟的生长速率。还发现,像Si一样,存在临界氧化物厚度,在该临界氧化物厚度以下,无法应用线性抛物线模型。对于4H-SiC上的SiO_2,发现该值在36至40nm之间,并且显然与晶体取向和氧化压力无关。提取的临界厚度及其特性与在Si上观察到的相似,这表明快速生长机制取决于氧化物的性质。最后,显示了在(0001)Si面上的界面态(D_(it))的密度没有被所监测的能量窗口内的更快的氧化物生长速率所降低。

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