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Study of insulator traps in InSb InSb/SiO_x/Metal devices

机译:InSb InSb / SiO_x /金属器件中绝缘子陷阱的研究

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摘要

In this study we investigated traps in InSb/SiO_x/Metal structure. In particular, emphasis was given to various methods of charging and discharging the interfaces and SiO_x layers by thermal-bias-stress. It is shown that the widely used capacitance-voltage profiling is insensitive to trap energies. Thus additional, complementary methods, such as thermally stimulated discharge were adopted and used to deepen the understanding. It is proposed that the traps in the passivation layer are charged by dc leakage current, and that the distribution of trap energies is not uniform. Furthermore, we report here methods that were developed to charge and discharge specific trap levels selectively.
机译:在这项研究中,我们研究了InSb / SiO_x /金属结构中的陷阱。特别地,重点在于通过热偏置应力对界面和SiO_x层进行充电和放电的各种方法。结果表明,广泛使用的电容电压曲线对陷阱能量不敏感。因此,采用了其他补充方法,例如热激发放电,并加深了对它们的理解。提出钝化层中的陷阱由直流泄漏电流充电,并且陷阱能量的分布不均匀。此外,我们在这里报告了为选择性地对特定陷阱水平进行充电和放电而开发的方法。

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  • 来源
    《Journal of Applied Physics》 |2010年第8期|084510.1-084510.7|共7页
  • 作者单位

    Faculty of Engineering, Tel Aviv University, 69978 Tel Aviv, Israel;

    Faculty of Engineering, Tel Aviv University, 69978 Tel Aviv, Israel;

    Faculty of Engineering, Tel Aviv University, 69978 Tel Aviv, Israel;

    Faculty of Engineering, Tel Aviv University, 69978 Tel Aviv, Israel;

    Semi Conductor Devices (SCD), P.O. Box 2250, 31021 Haifa, Israel;

    rnSemi Conductor Devices (SCD), P.O. Box 2250, 31021 Haifa, Israel;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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