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首页> 外文期刊>Journal of Applied Physics >Dielectric microwave characterizations of (Ba,Sr)TiO_3 film deposited on high resistivity silicon substrate: Analysis by two-dimensional tangential finite element method
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Dielectric microwave characterizations of (Ba,Sr)TiO_3 film deposited on high resistivity silicon substrate: Analysis by two-dimensional tangential finite element method

机译:高电阻率硅衬底上沉积的(Ba,Sr)TiO_3薄膜的介电微波特性:二维切向有限元分析

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摘要

(Ba,Sr)TiO_3 (BST) thin films were deposited on high resistivity silicon substrates by in situ rf magnetron sputtering. A buffer layer was used to improve the cristallinity of the films, the composition was fixed to Ba/Sr=30/70. The relative permittivity and the losses were measured up to 60 GHz using coplanar strip lines. The dispersion of the permittivity and the losses has been determined with a home made numerical code based on finite elements: elfi. We show that, with the measurements of the scattering parameters coupled with ELFI, it is possible to know the BST complex permittivity over a very broad frequency band. The BST films deposited by in situ (700 ℃) present excellent properties between 1 to 60 GHz. The relative permittivity is in the order of 270 and the losses are very small 0.09 at 60 GHz. These structures BST/silicon high resistivity show good potentialities for devices microwaves applications which need future integration in a silicon environment.
机译:通过原位射频磁控溅射在高电阻率的硅衬底上沉积(Ba,Sr)TiO_3(BST)薄膜。使用缓冲层来改善膜的结晶度,将组成固定为Ba / Sr = 30/70。使用共面带状线测量了高达60 GHz的相对介电常数和损耗。介电常数和损耗的色散已通过基于有限元elfi的自制数字代码确定。我们表明,通过与ELFI耦合的散射参数的测量,可以知道非常宽频带上的BST复介电常数。原位(700℃)沉积的BST薄膜在1至60 GHz之间具有优良的性能。相对介电常数约为270,在60 GHz时损耗很小,仅为0.09。这些结构BST /硅的高电阻率对于需要将来集成在硅环境中的器件微波应用显示出良好的潜力。

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  • 来源
    《Journal of Applied Physics》 |2010年第5期|p.054112.1-054112.5|共5页
  • 作者单位

    Institute of Electronics, Microelectronics, and Nanotechnology (IEMN), UMR CNRS 8520, Universite des Sciences et Technologies de Lille, BP 60069, 59652 Villeneuve d'Ascq Cedex, France;

    Institute of Electronics, Microelectronics, and Nanotechnology (IEMN), UMR CNRS 8520, Universite des Sciences et Technologies de Lille, BP 60069, 59652 Villeneuve d'Ascq Cedex, France;

    Institute of Electronics, Microelectronics, and Nanotechnology (IEMN), UMR CNRS 8520, Universite des Sciences et Technologies de Lille, BP 60069, 59652 Villeneuve d'Ascq Cedex, France;

    Institute of Electronics, Microelectronics, and Nanotechnology (IEMN), UMR CNRS 8520, Universite des Sciences et Technologies de Lille, BP 60069, 59652 Villeneuve d'Ascq Cedex, France;

    Institute of Electronics, Microelectronics, and Nanotechnology (IEMN), UMR CNRS 8520, Universite des Sciences et Technologies de Lille, BP 60069, 59652 Villeneuve d'Ascq Cedex, France;

    Institute of Electronics, Microelectronics, and Nanotechnology (IEMN), UMR CNRS 8520, Universite des Sciences et Technologies de Lille, BP 60069, 59652 Villeneuve d'Ascq Cedex, France;

    STMicroelectronics, SAS 16, rue Pierre et Marie Curie, BP 7155, 37071 Tours, France;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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