首页> 外文期刊>Journal of Applied Physics >Reduction of RESET current in phase change memory devices by carbon doping in GeSbTe films
【24h】

Reduction of RESET current in phase change memory devices by carbon doping in GeSbTe films

机译:通过在GeSbTe膜中进行碳掺杂来减少相变存储器件中的RESET电流

获取原文
获取原文并翻译 | 示例
           

摘要

Phase Change Memory (PCM) has been proposed for use as a substitute for flash memory to satisfy the huge demands for high performance and reliability that promise to come in the next generation. In spite of its high scalability, reliability, and simple structure, high writing current, e.g., RESET current, has been a significant obstacle to achieving a high density in storage applications and the low power consumption required for use in mobile applications. We report herein on an attempt to determine the level of carbon incorporated into a GeSbTe (GST) film that is needed to reduce the RESET current of PCM devices. The crystal structure of the film was transformed into an amorphous phase by carbon doping, the stability of which was enhanced with increasing carbon content. This was verified by the small grain size and large band gap that are typically associated with carbon. The increased level of C-Ge covalent bonding is responsible for these enhancements. Thus, the resistance of the carbon doped Ge_2Sb_2Te_5 film was higher than that for an undoped GST film by a factor of 2 orders of magnitude after producing a stable face-centered cubic phase by annealing. As a consequence, the PCM devices showed a significant reduction in RESET current as low as 23% when the carbon content was increased to 11.8 at. %. This can be attributed to the elevated SET resistance, which is proportional to the dynamic resistance of the PCM device, caused by the high resistance due to a carbon doped GST film.
机译:相变存储器(PCM)已被提议用作闪存的替代品,以满足下一代对高性能和可靠性的巨大需求。尽管其高可扩展性,可靠性和简单的结构,但是高写入电流(例如,RESET电流)已经成为在存储应用中实现高密度和在移动应用中使用所需的低功耗的重大障碍。我们在这里报告有关尝试确定掺入GeSbTe(GST)膜中的碳含量的尝试,以减少PCM器件的RESET电流。通过碳掺杂将膜的晶体结构转变为非晶相,其稳定性随着碳含量的增加而增强。通常与碳有关的小晶粒尺寸和大带隙证明了这一点。 C-Ge共价键水平的提高是这些增强的原因。因此,在通过退火产生稳定的面心立方相之后,掺碳的Ge_2Sb_2Te_5膜的电阻比未掺杂的GST膜的电阻高2个数量级。结果,当碳含量增加到11.8 at时,PCM器件显示出RESET电流的显着降低,低至23%。 %。这可以归因于由于碳掺杂的GST膜引起的高电阻而导致的SET电阻升高,该电阻与PCM器件的动态电阻成比例。

著录项

  • 来源
    《Journal of Applied Physics》 |2015年第11期|115703.1-115703.6|共6页
  • 作者单位

    Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, South Korea,Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd., San#16, Banwol-Dong, Hwasung-City, Gyeonggi-Do 445-701, South Korea;

    Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, South Korea;

    Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, South Korea;

    Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd., San#16, Banwol-Dong, Hwasung-City, Gyeonggi-Do 445-701, South Korea;

    Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd., San#16, Banwol-Dong, Hwasung-City, Gyeonggi-Do 445-701, South Korea;

    Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd., San#16, Banwol-Dong, Hwasung-City, Gyeonggi-Do 445-701, South Korea;

    Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd., San#16, Banwol-Dong, Hwasung-City, Gyeonggi-Do 445-701, South Korea;

    Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd., San#16, Banwol-Dong, Hwasung-City, Gyeonggi-Do 445-701, South Korea;

    Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd., San#16, Banwol-Dong, Hwasung-City, Gyeonggi-Do 445-701, South Korea;

    Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, South Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号