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首页> 外文期刊>Journal of Applied Physics >A high power impulse magnetron sputtering model to explain high deposition rate magnetic field configurations
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A high power impulse magnetron sputtering model to explain high deposition rate magnetic field configurations

机译:用于解释高沉积速率磁场配置的大功率脉冲磁控溅射模型

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摘要

High Power Impulse Magnetron Sputtering (HiPIMS) is one of the recent developments in the field of magnetron sputtering technology that is capable of producing high performance, high quality thin films. Commercial implementation of HiPIMS technology has been a huge challenge due to its lower deposition rates compared to direct current Magnetron Sputtering. The cylindrically symmetric "TriPack" magnet pack for a 10 cm sputter magnetron that was developed at the Center for Plasma Material Interactions was able to produce higher deposition rates in HiPIMS compared to conventional pack HiPIMS for the same average power. The "TriPack" magnet pack in HiPIMS produces superior substrate uniformity without the need of substrate rotation in addition to producing higher metal ion fraction to the substrate when compared to the conventional pack HiPIMS [Raman et al., Surf. Coat. Technol. 293, 10 (2016)]. The films that are deposited using the "TriPack" magnet pack have much smaller grains compared to conventional pack DC and HiPIMS films. In this paper, the reasons behind the observed increase in HiPIMS deposition rates from the TriPack magnet pack along with a modified particle flux model is discussed.
机译:高功率脉冲磁控溅射(HiPIMS)是磁控溅射技术领域的最新发展之一,能够生产高性能,高质量的薄膜。由于HiPIMS技术的沉积速率比直流磁控溅射法低,因此其在商业上的应用面临着巨大的挑战。在等离子材料相互作用中心开发的用于10 cm溅射磁控管的圆柱形对称“ TriPack”磁体组件在相同的平均功率下,与传统的组件HiPIMS相比,能够在HiPIMS中产生更高的沉积速率。与传统的包装HiPIMS相比,HiPIMS中的“ TriPack”磁体包装可产生出众的基材均匀性,而无需旋转基材,而且可向基材产生更高的金属离子分数[Raman等,Surf。涂层。技术。 293,10(2016)]。与常规包装DC和HiPIMS薄膜相比,使用“ TriPack”磁体包装沉积的薄膜的晶粒要小得多。在本文中,讨论了从TriPack磁体包装中观察到的HiPIMS沉积速率增加以及改进的粒子通量模型背后的原因。

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  • 来源
    《Journal of Applied Physics 》 |2016年第16期| 163301.1-163301.9| 共9页
  • 作者单位

    University of Illinois at Urbana Champaign, Urbana, Illinois 61801, USA;

    University of Illinois at Urbana Champaign, Urbana, Illinois 61801, USA;

    University of Illinois at Urbana Champaign, Urbana, Illinois 61801, USA;

    University of Illinois at Urbana Champaign, Urbana, Illinois 61801, USA;

    University of Illinois at Urbana Champaign, Urbana, Illinois 61801, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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