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首页> 外文期刊>Journal of Applied Electrochemistry >Kinetics of electroless copper deposition using cobalt(II)-ethylenediamine complex compounds as reducing agents
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Kinetics of electroless copper deposition using cobalt(II)-ethylenediamine complex compounds as reducing agents

机译:使用钴(II)-乙二胺络合物作为还原剂进行化学镀铜的动力学

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摘要

Electroless copper deposition using Co(II)-ethylenediamine (En) complexes as reducing agents was investigated in 0.4–1.2 M En solutions at 50 and 70 °C. There is a complicated dependence of the process rate on pH, En concentration and temperature. A copper deposition rate up to 6 μm h−1 (50–70 °C) in relatively stable solutions (pH ∼ 6) can be achieved. The stoichiometry of the Cu(II) reduction at pH 6–7 corresponds to the reaction: $${text{Cu}}En_2^{2 + } + 2{text{ Co}}En_2^{2 + } xrightarrow{{{text{Cu}}}}{text{Cu + 2 Cu}}En_3^{3 + } $$ The correlation between the rate of the copper deposition on the catalytic surface and the concentration of the ${text{Cu}}En_2^{2 + } $ complex species in the solution was found.
机译:使用Co(II)-乙二胺(En)络合物作为还原剂在0.4–1.2 M En溶液中于50和70°C下进行了化学镀铜。处理速率对pH,En浓度和温度具有复杂的依赖性。在相对稳定的溶液(pH〜6)中,铜的沉积速率可达到6μmh-1 (50–70°C)。 Cu(II)在pH 6–7下的化学计量对应于以下反应:$$ {text {Cu}} En_2 ^ {2 +} + 2 {text {Co}} En_2 ^ {2 +} xrightarrow {{ {text {Cu}}}} {text {Cu + 2 Cu}} En_3 ^ {3 +} $$ $$催化表面上的铜沉积速率与$ {text {Cu}}的浓度之间的相关性在溶液中发现En_2 ^ {2 +} $复杂物种。

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