Kinetics of electroless silver deposition using cobalt(II)-ammonia complex compounds as reducing agents

摘要

The kinetics of electroless silver deposition from solutions containing Co(II)-ammonia complex compounds as reducing agents was studied at 20 and 50 degreesC. The process rate depends on the solution pH and the concentration of Ag(I), Co(II) and ammonia species. Under optimum operating conditions selected a silver deposition rate up to 1.2 mum h(-1) can be obtained at 20 degreesC with high solution stability. At elevated temperature (50 degreesC) the rate increases and reaches similar to3 mum h(-1). The silver coatings obtained are of high quality, compact and bright. [References: 21]