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Surface roughness of thin silver films pulse-plated using silver cyanide-thiocyanate electrolyte

机译:氰化硫氰酸盐电解质脉冲镀银薄膜的表面粗糙度

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We investigated the effect of the pulse current density, current-on time and current-off time on the surface roughness of a silver thin film that was pulse-plated using a silver cyanide-thiocyanate electrolyte. The interface width, which is defined by the root mean square of the fluctuations in the height of the surface, is found to decrease rapidly with the current-off time and to increase with current-on time. However, it should be noted that when the value of current-off time is sufficiently large, the interface width decreases with pulse current density. These experimental results indicate that by appropriate selection of the current-on time and current-off time, we can fabricate silver electrodeposits with minimal surface roughness. We have discussed the influence of these three parameters on the interface width from the viewpoint of the cathode potential and adsorption.
机译:我们研究了脉冲电流密度,通电时间和断电时间对使用氰化硫氰酸银电解质进行脉冲电镀的银薄膜表面粗糙度的影响。发现由表面高度波动的均方根定义的界面宽度随电流断开时间而迅速减小,而随电流接通时间而增大。但是,应当注意,当电流断开时间的值足够大时,界面宽度随着脉冲电流密度而减小。这些实验结果表明,通过适当选择电流接通时间和电流断开时间,我们可以制造出具有最小表面粗糙度的银电沉积层。从阴极电势和吸附的角度,我们已经讨论了这三个参数对界面宽度的影响。

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