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Fabrication of V_(1-x)Ti_xO_2 thin films by metal-organic decomposition using carbon thermal reduction

机译:使用碳热还原制备v_(1-x)Ti_xO_2薄膜的金属有机分解

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摘要

V1-xTixO2 thin films were fabricated on Si3N4/SiO2/Si substrates by metal-organic decomposition. The VO2 phase in the range of x= 0-0.25 was obtained by preparing the precursor film calcined at 300 degrees C for 15 min in a N-2 atmosphere and firing these films at 580 degrees C-600 degrees C for 15 min in a N-2 atmosphere. V1-xTixO2 thin films were successfully obtained by carbon thermal reduction. In the resistance-temperature characteristics, the reduction of hysteresis and the broadening of metal-insulator transition (MIT) occurred with increasing x, and hysteresis and a significant resistance change due to the MIT disappeared at x = 0.25. The temperature coefficients of resistance (TCRs) at x= 0-0.25 were as high as -4.1 similar to -5.5%/K at 27 degrees C. At x= 0.25, TCRs were -4.3 similar to - 7.0%/K from 45 degrees C to 65 degrees C and a flat temperature dependence of TCR were realized at the temperature range from 10 degrees C to 80 degrees C. (C) 2019 The Japan Society of Applied Physics
机译:通过金属 - 有机分解在Si3N4 / SiO 2 / Si基材上制造V1-Xtixo2薄膜。通过在300℃下煅烧15分钟的前体膜在N-2大气中煅烧15分钟并在580℃-600℃下烧制15分钟,得到X = 0-0.25的VO2相。 N-2气氛。通过碳热还原成功获得V1-Xtixo2薄膜。在电阻温度特征中,滞后的减少和金属绝缘体转变(MIT)的扩大随着X的增加而发生,并且由于麻省理工学院而在X = 0.25下消失了滞后和显着的电阻变化。 X = 0-0.25处的电阻(TCR)的温度系数高达-4.1,与-5.5%/ k在27℃下,在x = 0.25时,TCR为-4.3与-7.0%/ k相似45在10摄氏度至80摄氏度的温度范围内实现TCR的温度依赖性度和平坦温度依赖性。(c)2019年日本应用物理学学会

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  • 来源
    《Japanese journal of applied physics》 |2019年第7期|075506.1-075506.6|共6页
  • 作者单位

    Natl Def Acad Dept Elect & Elect Engn Yokosuka Kanagawa 2398686 Japan;

    Kojyundo Chem Lab Co Ltd Sakado Saitama 3500284 Japan;

    Kojyundo Chem Lab Co Ltd Sakado Saitama 3500284 Japan;

    Natl Def Acad Dept Elect & Elect Engn Yokosuka Kanagawa 2398686 Japan;

    Natl Def Acad Dept Elect & Elect Engn Yokosuka Kanagawa 2398686 Japan;

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