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首页> 外文期刊>Japanese journal of applied physics >Low-temperature formation of high-mobility a-lnGaZnOx films using plasma- enhanced reactive processes
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Low-temperature formation of high-mobility a-lnGaZnOx films using plasma- enhanced reactive processes

机译:使用等离子增强反应工艺低温形成高迁移率的a-InGaZnOx薄膜

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摘要

This work demonstrated the low-temperature fabrication of high-mobility a-InGaZnOx (a-IGZO) films using plasma-enhanced reactive processing. The effect of the post-processing temperature on the performance of IGZO thin-film transistors (TFTs) using these a-IGZO films as a channel layer was also investigated. IGZO TFTs incorporating a-IGZO films plasma-treated at temperatures as low as 200 degrees C exhibited the expected TFT transfer characteristics, with field effect mobility values as high as 40 cm(2) V-1 s(-1). The fabrication of IGZO TFTs that exhibited homogeneous characteristics over large substrate areas was attempted, by assessing the effects of the plasma treatment on a-IGZO films deposited at various oxygen flow rate ratios. The electrical properties of IGZO TFTs using plasma-treated films were found to be dramatically improved, irrespective of the film deposition conditions prior to the plasma treatment. These results confirm the feasibility of producing IGZO TFTs with uniform characteristics over large substrates areas. (C) 2019 The Japan Society of Applied Physics
机译:这项工作证明了使用等离子增强反应工艺在低温下制备高迁移率的a-InGaZnOx(a-IGZO)薄膜。还研究了后处理温度对使用这些a-IGZO膜作为沟道层的IGZO薄膜晶体管(TFT)性能的影响。结合了在200摄氏度以下的温度下进行等离子体处理的a-IGZO薄膜的IGZO TFT表现出预期的TFT传输特性,场效应迁移率值高达40 cm(2)V-1 s(-1)。通过评估等离子体处理对以各种氧气流量比沉积的a-IGZO膜的影响,尝试制造在大基板面积上均质的IGZO TFT。发现使用等离子处理膜的IGZO TFT的电性能得到了显着改善,而与等离子处理之前的膜沉积条件无关。这些结果证实了在大基板面积上生产具有均匀特性的IGZO TFT的可行性。 (C)2019日本应用物理学会

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