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首页> 外文期刊>Japanese Journal of Applied Physics. Part 2, Letters >Extrinsic Base Regrowth of p-InGaN for Npn-Type GaN/InGaN Heterojunction Bipolar Transistors
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Extrinsic Base Regrowth of p-InGaN for Npn-Type GaN/InGaN Heterojunction Bipolar Transistors

机译:用于Npn型GaN / InGaN异质结双极晶体管的p-InGaN的非本征基极生长

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摘要

The regrowth of p-InGaN as the extrinsic base layer of Npn-type GaN/InGaN heterojunction bipolar transistors (HBTs) significantly improves the ohmic characteristics of the base layer. The specific contact resistance is 7.8 x 10~(-4) Ω·cm~2 even after the dry etching. This value for a non-alloyed ohmic contact is much better than that for as-grown p-GaN (1.7 x 10~(-3) Ω·cm~2) and decreased turn-on voltage in the emitter-base diodes, which results in high current gains of up to 2000 and reduced offset voltages in the GaN/InGaN HBTs. These results show that the p-InGaN extrinsic base regrowth is an effective way to improve nitride HBT characteristics.
机译:作为Npn型GaN / InGaN异质结双极晶体管(HBT)的非本征基极层,p-InGaN的再生长显着改善了基极层的欧姆特性。即使在干法蚀刻之后,比接触电阻也为7.8×10〜(-4)Ω·cm〜2。对于非合金欧姆接触,该值要比生长的p-GaN(1.7 x 10〜(-3)Ω·cm〜2)更好,并且发射极基极二极管的导通电压降低,因此该值要好得多。从而导致高达2000的高电流增益,并降低了GaN / InGaN HBT中的失调电压。这些结果表明,p-InGaN非本征基极再生长是改善氮化物HBT特性的有效途径。

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