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首页> 外文期刊>Japanese Journal of Applied Physics. Part 2, Letters & Express Letters >Time-Resolved Measurement of Charging on Hole Bottoms of SiO_2 Wafer Exposed to Plasma Etching in a Pulsed Two-Frequency Capacitively Coupled Plasma
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Time-Resolved Measurement of Charging on Hole Bottoms of SiO_2 Wafer Exposed to Plasma Etching in a Pulsed Two-Frequency Capacitively Coupled Plasma

机译:在脉冲两频电容耦合等离子体中暴露于等离子刻蚀的SiO_2晶片的孔底电荷的时间分辨测量

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摘要

We experimentally demonstrate a time chart of the shading either of electrons or positive ions on a topologically patterned wafer exposed to plasma etching by synchronized measurements of bottom-charging potential in a SiO_2 hole, current components incident on the wafer, and optical emission CT in the interface in a pulsed two frequency capacitively coupled plasma. The present paper gives a history of charging affected dynamically by an instantaneous electrical response on the bottom.
机译:我们通过同步测量SiO_2孔中的底部充电电势,入射到晶片上的电流分量以及晶片中的光发射CT,通过实验证明了暴露于等离子刻蚀的拓扑图案化晶片上电子或正离子的阴影时序图。脉冲两频电容耦合等离子体中的接口。本文给出了受底部瞬时电响应动态影响的充电历史。

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