首页> 外文期刊>Japanese Journal of Applied Physics. Part 1, Regular Papers, Brief Communications & Review Papers >High-Coupling and High-Temperature Stable Surface Acoustic Wave Substrates Using Groove-Type Interdigital Transducer
【24h】

High-Coupling and High-Temperature Stable Surface Acoustic Wave Substrates Using Groove-Type Interdigital Transducer

机译:使用凹槽型叉指式换能器的高耦合和高温稳定表面声波基片

获取原文
获取原文并翻译 | 示例
获取外文期刊封面目录资料

摘要

In this study, to obtain new substrates with the high coupling of electromechanical coefficients (k~2) and near-zero temperature coefficients of frequency (TCFs), very thin periodic grooves and interdigital transducers (IDTs) are fabricated on high-coupling substrates. Simulation results show a high k~2 (over 0.4) at H/λ = 0.1 for rotated Y-cut, X-propagating LiNbO_3 leaky surface acoustic wave substrates, and a high k~2 (over 0.08) and a small TCF (-10ppm/℃) at H/λ = 0.1 for 36° Y-cut, X-propagating LiTaO_3 leaky surface acoustic wave (SAW) substrates. The experimental results showed good agreements with the theoretical results.
机译:在这项研究中,为了获得具有高机电系数(k〜2)和接近零温度频率系数(TCF)耦合的新基板,在高耦合基板上制造了非常薄的周期性凹槽和叉指换能器(IDT)。仿真结果表明,旋转Y形,X传播的LiNbO_3泄漏表面声波基片在H /λ= 0.1时高k〜2(超过0.4),高k〜2(超过0.08)和小的TCF(-对于36°Y切割,X传播的LiTaO_3泄漏表面声波(SAW)基板,在H /λ= 0.1时10ppm /℃)。实验结果与理论结果吻合良好。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号