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首页> 外文期刊>Japanese Journal of Applied Physics. Part 2, Letters & Express Letters >Phase Transition Characteristics and Device Performance of Sn-doped Ge_2Sb_2Te_5 in Phase Change Random Access Memory
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Phase Transition Characteristics and Device Performance of Sn-doped Ge_2Sb_2Te_5 in Phase Change Random Access Memory

机译:相变随机存取存储器中掺Sn的Ge_2Sb_2Te_5的相变特性及器件性能

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摘要

Sn was employed in Ge_2Sb_2Te_5 to accelerate operation speed of phase change random access memory (PRAM). Crystallized Sn-doped Ge_2Sb_2Te_5 showed face centered cubic (fcc) or hexagonal close packed (hcp) structures upon heat treatment, which was similar to that of Ge_2Sb_2Te_5. However, Sn doping increased the phase transformation temperature to hcp of Ge_2Sb_2Te_5. 17 at. % Sn-doped Ge_2Sb_2Te_5 had an accelerated crystallization under laser irradiation and moreover, showed decreased operation time of PRAM compared to that of Ge_2Sb_2Te_5. In addition, 17 at. % Sn-doped Ge_2Sb_2Te_5 showed stable and reversible device performance.
机译:在Ge_2Sb_2Te_5中采用Sn可以加快相变随机存取存储器(PRAM)的运行速度。晶化的Sn掺杂Ge_2Sb_2Te_5在热处理后表现出面心立方(fcc)或六方密堆积(hcp)结构,与Ge_2Sb_2Te_5相似。然而,Sn掺杂将相变温度提高到Ge_2Sb_2Te_5的hcp。 17时%Sn掺杂的Ge_2Sb_2Te_5在激光照射下具有加速的结晶,此外,与Ge_2Sb_2Te_5相比,PRAM的操作时间缩短。此外,位于17点。掺Sn的Ge_2Sb_2Te_5%表现出稳定且可逆的器件性能。

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