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Superlattice-like Structures with Nitrogen-doped Germanium-Antimony-Telluride for Phase Change Random Access Memory.

机译:具有相变随机存取存储器的氮掺杂锗锑碲化物的超晶格状结构。

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摘要

Phase Change Random Access Memory (PCRAM) is regarded as one of the leading Nonvolatile memory (NVM) technology candidates to replace FLASH as device feature sizes are reduced due to its high endurance, excellent retention and most importantly scalability. Ge2Sb2Te5 (GST) is the most common phase change material used in prototypical PCRAM devices due to its good speed and stability. Despite these attractive memory attributes, the programming current of GST based PCRAM is relatively high and the crystallization time is relatively long as such these issues compromise the memory density and slows the write/erase speed respectively.;In general, PCRAM performance, in particular programming current and speed are usually enhanced by altering the material properties of the phase change material but to do so often require modification of GST's stoichiometry usually through trial and error. Because the properties of phase change materials are strongly dependent on the film thickness, interface and composition, phase change superlattice-like (SLL) structures composed of two or more phase change materials alternatively stacked on top of each other offers a systematic way of improving the PCRAM performance.;This work investigates the potential of reducing the programming current and crystallization time through the use of SLL structures based on nitrogen-doped GST (N-GST) in PCRAM devices. To reduce the programming current of PCRAM devices, we proposed and fabricated a lattice matched N-GST/GST SLL structure and implemented this in PCRAM devices. The N-GST/GST SLL PCRAM showed a ∼37% reduction in RESET current and this significantly improves PCRAM's memory density. The lattice matching material combination possibly reduced the stress within the SLL structure enabling the N-GST/GST SLL PCRAM to achieve improved switching endurances of 108 cycles.;The influence of the interfaces and layer thickness on the crystallization of N-GST/GST SLL structures was investigated using transient crystallization pulses. The crystallization and nucleation times of the N-GST/GST SLL PCRAM were found to be reduced by ∼37.5% and ∼46.4% respectively when compared to GST based PCRAM. These improvements are most likely due to the N-GST/GST interfaces which promote heterogeneous nucleation.;Through nano-scale thermal engineering, a low thermal conductivity electrode using N-GST was developed. By alternatively stacking thin films of N-GST and TiW, a low thermal conductivity SLL electrode was created and implemented in PCRAM devices. Devices with SLL electrodes displayed ∼10% reduction in RESET current and ∼34% reduction in power compared to PCRAM devices with conventional TiW electrodes possibly due to the improved thermal confinement and heating efficiency.
机译:相变随机存取存储器(PCRAM)被认为是取代FLASH的领先非易失性存储器(NVM)技术之一,因为其高耐用性,出色的保留性和最重要的是可扩展性,从而缩小了器件的功能尺寸。 Ge2Sb2Te5(GST)是原型PCRAM器件中最常用的相变材料,因为它具有良好的速度和稳定性。尽管具有这些吸引人的存储属性,但基于GST的PCRAM的编程电流相对较高,并且结晶时间相对较长,因为这些问题分别损害了存储密度并减慢了写入/擦除速度。通常通过改变相变材料的材料特性来提高电流和速度,但是这样做通常需要通过反复试验来修改GST的化学计量。由于相变材料的特性在很大程度上取决于膜的厚度,界面和组成,因此,由两种或多种彼此交替堆叠的相变材料组成的相变超晶格状(SLL)结构提供了一种系统的方法来改善PCRAM性能。;这项工作研究了通过在PCRAM器件中使用基于氮掺杂GST(N-GST)的SLL结构来降低编程电流和结晶时间的潜力。为了降低PCRAM器件的编程电流,我们提出并制造了晶格匹配的N-GST / GST SLL结构,并将其实现在PCRAM器件中。 N-GST / GST SLL PCRAM的RESET电流降低了约37%,这显着提高了PCRAM的存储密度。晶格匹配材料的组合可能会降低SLL结构内的应力,从而使N-GST / GST SLL PCRAM能够实现108个循环的改善的开关耐力。;界面和层厚度对N-GST / GST SLL结晶的影响使用瞬态结晶脉冲研究了结构。与基于GST的PCRAM相比,N-GST / GST SLL PCRAM的结晶时间和成核时间分别减少了约37.5%和约46.4%。这些改进最有可能是由于N-GST / GST界面促进了异相成核。通过纳米级热工程技术,开发了一种使用N-GST的低导热电极。通过交替堆叠N-GST和TiW薄膜,可以创建低导热SLL电极并在PCRAM器件中实现。与具有传统TiW电极的PCRAM器件相比,具有SLL电极的器件的RESET电流降低约10%,功率降低约34%,这可能是由于改善了热限制和加热效率。

著录项

  • 作者

    Tan, Chun Chia.;

  • 作者单位

    Carnegie Mellon University.;

  • 授予单位 Carnegie Mellon University.;
  • 学科 Electrical engineering.
  • 学位 Ph.D.
  • 年度 2012
  • 页码 150 p.
  • 总页数 150
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

  • 入库时间 2022-08-17 11:42:59

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