Effect of Back Mold Grooves on Improving Uniformity in Nanoimprint Lithography

摘要

The nanoimprint technique has the advantages of high throughput, sub-10-nm resolution and low cost. However, the nonuniform surface obtained in practice raises concerns about the quality of pattern transfer. In this study, we present a uniform printing method across a wafer by introducing a local mold deformation along the block boundary. This method is simple and effective: it involves cutting grooves on the back of the mold within the nonpatterned area. The grooves enable the mold to lie easily on the substrate with a close fit to obtain a more uniform pattern over a large surface. The proposed method was demonstrated experimentally.