Plasma-Enhanced Co-Polymerization of Organo-siloxane and Hydrocarbon for Low-k/Cu Interconnects

摘要

A plasma-enhanced co-polymerization technique was developed for low-k/Cu damascene integration on 300 mm wafers. This technique enables us to control dielectric film properties by introducing organo-siloxane and hydrocarbon into a He-plasma. The growth rate of the low-k film derived from divinyl siloxane-benzocyclobutene (DVS-BCB) as a matrix monomer is increased by adding C_2H_2 as a deposition acceleration monomer and the Young's modulus was enhanced by adding diisopropenylbenzene (DIPB) or divinylbenzene (DVB) as a reinforcement monomer. Cu damascene interconnects with plasma polymerized low-k films were successfully fabricated on 300mm wafers.