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Investigation and Integration of Polycrystalline Silicon/TiN/SiON Gate Stack in Silicon on Thin Buried Oxide Complementary Metal Oxide Semiconductor Field Effect Transistors

机译:薄埋氧化物互补金属氧化物半导体场效应晶体管上硅中多晶硅/ TiN / SiON栅堆叠的研究与集成

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摘要

We developed fully depleted silicon on thin buried oxide (SOTB) complementary metal oxide semiconductor field effect transistors (CMOSFETs) with a polycrystalline-silicon (poly-Si)/TiN/SiON gate stack. We investigated the flat-band voltage (V_(fb)) shift of the gate stack for the threshold voltage (V_(th)) symmetry of SOTB CMOSFETs. We found that the V_(fb) shift depended on both TiN thickness and thermal load. Thicker TiN above 15nm is preferable for obtaining the midgap value of V_(th), with considering the thermal budget of the SOTB process. We also integrated the gate stack into SOTB CMOSFETs, which showed that the V_(th), roll-off characteristics corresponded to the proper control of the effective work function by considering how the impurity-related work function modulation affects. Narrow channel characteristics of the TiN-gate SOTB CMOSFETs were also shown to be superior to fully silicided gate SOTB devices due to the less silicidation.
机译:我们在具有多晶硅(poly-Si)/ TiN / SiON栅极叠层的薄掩埋氧化物(SOTB)互补金属氧化物半导体场效应晶体管(CMOSFET)上开发了完全耗尽的硅。对于SOTB CMOSFET的阈值电压(V_(th))对称性,我们研究了栅极堆叠的平带电压(V_(fb))偏移。我们发现V_(fb)偏移取决于TiN厚度和热负荷。考虑到SOTB工艺的热预算,为了获得V_(th)的中间能隙值,最好使用15nm以上的TiN。我们还将栅极叠层集成到SOTB CMOSFET中,这表明通过考虑杂质相关功函数调制的影响,V_(th)的下降特性与有效功函数的正确控制相对应。 TiN栅极SOTB CMOSFET的窄沟道特性还因硅化物较少而优于完全硅化的栅极SOTB器件。

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  • 来源
    《Japanese journal of applied physics》 |2012年第7issue1期|p.076504.1-076504.5|共5页
  • 作者单位

    Central Research Laboratory, Hitachi, Ltd., Kokubunji, Tokyo 185-8601, Japan;

    Central Research Laboratory, Hitachi, Ltd., Kokubunji, Tokyo 185-8601, Japan;

    Central Research Laboratory, Hitachi, Ltd., Kokubunji, Tokyo 185-8601, Japan;

    Central Research Laboratory, Hitachi, Ltd., Kokubunji, Tokyo 185-8601, Japan;

    Central Research Laboratory, Hitachi, Ltd., Kokubunji, Tokyo 185-8601, Japan;

    Central Research Laboratory, Hitachi, Ltd., Kokubunji, Tokyo 185-8601, Japan;

    Central Research Laboratory, Hitachi, Ltd., Kokubunji, Tokyo 185-8601, Japan;

    Renesas Electronics Corporation, Hitachinaka, Ibaraki 312-8504, Japan;

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