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On gate stack scalability of double-gate negative-capacitance FET with ferroelectric HfO_2 for energy efficient sub-0.2 V operation

机译:具有铁电HfO_2的双栅负电容FET在栅堆叠上的可扩展性,可实现低于0.2 V的节能运行

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摘要

We have investigated the gate stack scalability and energy efficiency of double-gate negative-capacitance FET (DGNCFET) with a CMOS-compatible ferroelectric HfO2 (FE:HfO2). Analytic model-based simulation is conducted to investigate the impacts of ferroelectric characteristic of FE:HfO2 and gate stack thickness on the I-on/I-off ratio of DGNCFET. DGNCFET has wider design window for the gate stack where higher I-on/I-off ratio can be achieved than DG classical MOSFET. Under a process-induced constraint with sub-10 nm gate length (L-g), FE:HfO2-based DGNCFET still has a design point for high I-on/I-off ratio. With an optimized gate stack thickness for sub-10 nm L-g, FE:HfO2-based DGNCFET has 2.5x higher energy efficiency than DG classical MOSFET even at ultralow operation voltage of sub-0.2 V. (c) 2018 The Japan Society of Applied Physics
机译:我们已经研究了具有兼容CMOS的铁电HfO2(FE:HfO2)的双栅极负电容FET(DGNCFET)的栅极堆叠可扩展性和能效。进行了基于分析模型的仿真,以研究FE:HfO2的铁电特性和栅叠层厚度对DGNCFET的I-on / I-off比的影响。 DGNCFET具有比DG传统MOSFET更高的I-on / I-off比的栅极叠层设计窗口。在工艺引起的栅极长度小于10 nm(L-g)的约束下,基于FE:HfO2的DGNCFET仍然具有高I-on / I-off比的设计点。基于FE:HfO2的DGNCFET具有小于10 nm L-g的优化栅极堆叠厚度,即使在低于0.2 V的超低工作电压下,其能源效率也比DG经典MOSFET高2.5倍。(c)2018年日本应用物理学会

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