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On gate stack scalability of Double-Gate Negative-Capacitance FET with ferroelectric HfO2 for energy-efficient sub-0.2V operation

机译:具有铁电HfO2的双栅极负电容FET在栅堆叠上的可扩展性,可实现低于0.2V的节能运行

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We have investigated a Double-Gate Negative Capacitance FET (DGNCFET) with CMOS-compatible ferroelectric HfO2 (FE:HfO2) gate insulator and demonstrated high Ion/Ioff and Steep Subthreshold Swing (SS) for sub-0.2V operation by analytical model and simulation. Gate insulator and interfacial layer thickness dependence has been systematically studied for FE:HfO2 under process technology constraint, for the first time. The optimum gate stack can fit to the aggressively scaled Lg and it enables 2× higher energy efficiency at <;0.2V than conventional DGMOSFET.
机译:我们研究了双栅极负电容FET(DGNCFET),具有CMOS兼容的铁电HFO2(FE:HFO2)栅极绝缘体,并通过分析模型和仿真显示了用于子0.2V操作的高离子/ IOFF和陡峭的亚阈值摆动(SS) 。第一次,系统地研究了Fe:HFO2的Fe:HFO2的栅极绝缘体和界面层厚度依赖性。最佳栅极堆栈可以适合积极缩放的LG,并且它能够比传统DGMOSFET在<; 0.2V处实现2倍的能量效率。

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