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首页> 外文期刊>International Journal of Microcircuits & Electronic Packaging >Comparison of Paraelectric and Ferroelectric Materials for Applications as Dielectrics in Thin Film Integrated Capacitors
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Comparison of Paraelectric and Ferroelectric Materials for Applications as Dielectrics in Thin Film Integrated Capacitors

机译:薄膜集成电容器中用作电介质的顺电和铁电材料的比较

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摘要

Ferroelectrics such as BaTiO_3 and Ba_x Sr_1-x TiO_3 can exhibit dielectric constants up to three orders of magnitude higher than those of paraelectric materials such as SiO_2, Al_2O_3, Ta_2O_5, and BCB. However, the dielectric properties of ferroelectrics are typically a stronger function of temperature, frequency, film thickness, and bias resulting in significant nonlinearities in their perfor- mance. Also, the dielectric constant of some ferroelectrics degrades with time.
机译:铁电体(例如BaTiO_3和Ba_x Sr_1-x TiO_3)的介电常数比诸如SiO_2,Al_2O_3,Ta_2O_5和BCB的顺电材料的介电常数高三个数量级。但是,铁电体的介电特性通常是温度,频率,膜厚和偏置的更强函数,从而导致其性能出现明显的非线性。而且,一些铁电体的介电常数随时间降低。

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