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MANUFACTURING METHOD FOR FERROELECTRIC THIN FILM, DIELECTRIC THIN FILM AND INTEGRATED CIRCUIT CONTAINING FERROELECTRIC THIN FILM

机译:铁电薄膜,介电薄膜和包含铁电薄膜的集成电路的制造方法

摘要

PROBLEM TO BE SOLVED: To lower temperature and to speed up time for film-formation and to reduce leak current, in a film formation method, by a sol-gel method or an MOD method, for a ferroelectric thin film or a dielectric thin film consisting of a bismuth layer structured compound material. SOLUTION: A stage (step 1) wherein the precursor solution which contains at least a kind of metal and consists of metallic complex salt in solvent is applied on a film consisting of one or more layers on a substrate, for forming a thin film, a stage (step 2) wherein the thin film is dried for removing the solvent of the precursor solution, and a stage (step 3) wherein, with no stage wherein a thin film under amorphous condition is formed, the organic substance in the thin film is heated up above crystallization temperature at the speed above a specified temperature increase speed for crystallizing the thin film material, while the organic substance removed by thermal decomposition, are included in a thin film manufacturing method.
机译:解决的问题:对于铁电薄膜或电介质薄膜,在成膜方法中通过溶胶-凝胶法或MOD方法降低温度并加快成膜时间并减少泄漏电流。由铋层结构的复合材料组成。解决方案:在步骤(步骤1)中,将至少包含一种金属并由溶剂中的金属络合物盐组成的前体溶液涂在基底上一层或多层组成的薄膜上,以形成薄膜,步骤(步骤2),其中干燥薄膜以除去前体溶液的溶剂,步骤(步骤3),其中不形成无定形条件下的薄膜的步骤,薄膜中的有机物为在薄膜制造方法中包括以高于指定温度升高速度的速度加热到高于结晶温度的速度,以使薄膜材料结晶,同时通过热分解去除的有机物也包括在内。

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