机译:新型电力电子封装材料的可靠性评估:银金刚石复合材料
Center for Device Thermography and Reliability (CDTR), H.H. Wills Physics Laboratory, University of Bristol, Bristol, BS8 1TL, United Kingdom,Universite Internationale de Rabat (UIR), R&D center, Technopolis, Morocco;
Center for Device Thermography and Reliability (CDTR), H.H. Wills Physics Laboratory, University of Bristol, Bristol, BS8 1TL, United Kingdom;
Center for Device Thermography and Reliability (CDTR), H.H. Wills Physics Laboratory, University of Bristol, Bristol, BS8 1TL, United Kingdom;
Plansee SE, 6600 Reutte, Austria;
Plansee SE, 6600 Reutte, Austria;
Thales Alenia Space, 26 Ave. JF Champollion, 31037 Toulouse, France;
Thales Alenia Space, 26 Ave. JF Champollion, 31037 Toulouse, France;
Egide, Site Industriel du Sactar, 84500 Bollene, France;
Egide, Site Industriel du Sactar, 84500 Bollene, France;
CNES, 18, Ave. E. Belin, 31401 Toulouse, France;
CNES, 18, Ave. E. Belin, 31401 Toulouse, France;
Center for Device Thermography and Reliability (CDTR), H.H. Wills Physics Laboratory, University of Bristol, Bristol, BS8 1TL, United Kingdom;
Raman; silver diamond; composites; thermal management; packaging reliability;
机译:改善GaN电力电子设备的热管理:银金刚石复合封装
机译:高性能环氧/二氧化硅涂层的银纳米线复合材料,用作电子包装的底部填充材料
机译:快速电流辅助方法在功率电子封装中表征纳米烧结银接头及其可靠性
机译:GaN电力电子产品的新型封装解决方案:银-金刚石复合封装
机译:包装材料的热机械性能及其在电子包装可靠性评估中的应用。
机译:用于汽车和节能应用的功率电子半导体材料-SiCGaNGa2O3和金刚石
机译:用于汽车和节能应用的电力电子半导体材料 - SiC,GaN,Ga2 O3和钻石
机译:同步振动,热和高功率负载下的下一代电力电子封装的可靠性