首页> 外文期刊>International journal of micro-nano scale transport >Decreasing of Quantity of Radiation Defects in an Implanted-Junction Rectifier in a Semiconductor Heterostructure
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Decreasing of Quantity of Radiation Defects in an Implanted-Junction Rectifier in a Semiconductor Heterostructure

机译:减少半导体异质结中注入结整流器的辐射缺陷数量

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It has been recently shown, that manufacturing of an implanted-junction rectifier in a semiconductor heterostructure for optimal relation between annealing time of radiation defects, materials of the heterostructure and thicknesses of layers of the heterostructure and energy of implanted ions leads to increasing of sharpness of p - rir-junction and at the same time to increasing of homogeneity of dopant distribution in doped area. In this paper we consider an approach of annealing of radiation defects to decrease quantity of radiation defects in comparison with standard of annealing.
机译:最近显示,在半导体异质结构中制造注入结整流器以使辐射缺陷的退火时间,异质结构的材料和异质结构层的厚度与注入离子的能量之间的最佳关系成为可能,从而增加了离子的清晰度。 p-rir结,并同时增加掺杂区中掺杂剂分布的均匀性。与退火标准相比,本文考虑了一种对辐射缺陷进行退火的方法,以减少辐射缺陷的数量。

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