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An analytical method to estimate spatially-varying thermal contact conductances using the reciprocity functional and the integral transform methods: Theory and experimental validation

机译:一种使用互易函数和积分变换方法估算空间变化热接触电导的分析方法:理论和实验验证

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摘要

The increasingly interest in using composite materials in engineering application requires the proper knowledge of the interaction that occurs between their layers. One of these interactions is related to the temperature jump and heat flux through the interface of different materials, known as thermal contact resistance, or its reciprocal, the thermal contact conductance. Methods to estimate thermal contact resistance usually require temperature measurements taken inside the sample (test body) and complicated experimental arrangements. In this work we propose an analytical, non-iterative and non-intrusive method to solve an inverse heat transfer problem in order to estimate a one-dimensional steady-state distribution of the thermal contact conductance, combining the reciprocity functional and the Classical Integral Transform Technique (CITT). This paper is an extension of our previous works, where the solution procedure was developed numerically and required the solution of two linear systems. In this paper, the estimate is reduced to a single algebraic equation. The method was applied to some test cases using simulated measurements and results were compared with the exact solution showing a good agreement between them. A validation involving a double-layered material was also conducted, where an infrared camera was used to measure the temperature non-intrusively. A micromachinery produced flaw was created in the contact between the two materials and, once the temperature measurements were available, the method was able to identify the flaw location in 0.2 s using an Intel Atom(TM) CPU N450 1.66 GHz.
机译:在工程应用中使用复合材料的兴趣日益浓厚,需要对它们之间发生的相互作用有适当的了解。这些相互作用之一与温度跃变和通过不同材料的界面的热通量有关,称为热接触电阻,或者相反,即热接触电导。估算热接触电阻的方法通常需要在样品(测试体)内部进行温度测量并进行复杂的实验。在这项工作中,我们提出了一种分析,非迭代和非侵入式的方法来解决逆传热问题,以便结合互易函数和经典积分变换来估算热接触电导的一维稳态分布。技术(CITT)。本文是对我们先前工作的扩展,在此工作中,求解程序是通过数字方式开发的,并且需要求解两个线性系统。在本文中,该估计被简化为单个代数方程。将该方法应用于使用模拟测量的一些测试案例,并将结果与​​确切的解决方案进行比较,表明它们之间有很好的一致性。还进行了涉及双层材料的验证,其中使用红外热像仪非侵入式地测量温度。在两种材料之间的接触中产生了一个由微机械产生的缺陷,一旦温度测量可用,该方法就可以使用Intel Atom™CPU N450 1.66 GHz在0.2 s内识别出缺陷位置。

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