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Interlaced switch boxes placement for three-dimensional FPGA architecture design

机译:用于三维FPGA架构设计的交错开关盒布局

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Three-dimensional (3D) field programmable gate array (FPGA) has evoked significant interest in wire-length reduction for routing requirement. However, the complex design of the 3D switch boxes will limit the performance improvement and suffer from the area efficiency problems. This paper proposed a systematic graph model (SGM) for 3D switch boxes design to simplify the design process and reduce the storage memory for path programming. An interlaced 3D switch boxes and two-dimensional (2D) switch boxes placement topology is also presented in this paper to design the 3D FPGA architecture for area efficiency purpose. The 3D place and route tool and TSMC 0.18-um CMOS process parameters are used to support building the experimental flow for verification. Performance evaluation shows that about 50% storage memory reduction can be obtained by using the proposed SGM-based switch design approach. Additionally, compared with conventional architectures of 2D FPGA, the proposed scheme based on interlaced switch boxes placement approach can approximately achieve 20% delay-power product improvement and 43% area-delay product reduction.
机译:三维(3D)现场可编程门阵列(FPGA)引起了人们对于减少布线要求的线长的兴趣。但是,3D开关盒的复杂设计将限制性能的提高,并会遇到面积效率问题。本文提出了一种用于3D开关盒设计的系统图形模型(SGM),以简化设计过程并减少用于路径编程的存储空间。本文还提出了交错的3D开关盒和二维(2D)开关盒布局拓扑,以设计3D FPGA架构以实现区域效率。使用3D布局和布线工具以及TSMC 0.18-um CMOS工艺参数来支持建立用于验证的实验流程。性能评估表明,使用建议的基于SGM的交换机设计方法可以减少大约50%的存储内存。此外,与2D FPGA的常规体系结构相比,基于隔行开关盒放置方法的拟议方案可以大约实现20%的延迟功率乘积改善和43%的面积延迟乘积减少。

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