Modular Test System Architecture for Device, Circuit, and System Level Reliability Testing and Condition Monitoring

摘要

Reliability stress testing of power semiconductors requires significant development effort for a test apparatus to provide the required functionality. This paper presents a modular test system (MTS) architecture that focuses on flexibility, reusability, and adaptability to future test requirements. Different types of tests for different devices in application circuit configuration can be implemented based on the same MTS concept. Vital parameters of the device under test can be acquired in situ during the running stress test. This enables the collection of drift data of these parameters. The control and data acquisition parts of the test system are clearly separated from the actual test circuit. With this physical separation, the same control part can be used for different types of tests. Experimental results of an already implemented test system are provided.