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Massively parallel wafer-level reliability system and process for massively parallel wafer-level reliability testing

机译:大规模并行晶圆级可靠性系统和过程,用于大规模并行晶圆级可靠性测试

摘要

A massively parallel wafer-level reliability system to test a reliability of wafers includes: a test platform; stations disposed on the test platform, wherein an individual test station receives a wafer and includes: a chuck disposed on the test platform; a probe including contactors that electrically contact the wafer; and a temperature controller to control a temperature of the wafer; a control platform disposed among the test stations; and a system controller to independently control the test stations and that is in electrical communication with the temperature controller, wherein the reliability of the wafers is tested in parallel by the test stations.
机译:用于测试晶片可靠性的大规模并行晶片级可靠性系统包括:测试平台;放置在测试平台上的站,其中,各个测试站接收晶片,并且包括:放置在测试平台上的卡盘;探针,其包括与晶片电接触的接触器;温度控制器控制晶片的温度。位于测试站之间的控制平台;系统控制器独立地控制测试台并且与温度控制器电连通,其中晶片的可靠性由测试台并行测试。

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