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Impacts of Leakage-Biasing Failure-Mode Identification in the Transmission-Line Pulse Testing for Low-/High-Voltage MOSFET Components

机译:低压/高压MOSFET组件的传输线脉冲测试中的漏电-失效模式识别的影响

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The effects of leakage-biased voltage (VLB) levels are investigated in this paper, which are set for failure-mode identification on the final fault diagnostic measurement in transmission line pulse (TLP) testing. To identify the effect on electrostatic discharge (ESD) robustness, three types of MOSFET components were employed; namely, low-voltage n-channel MOSFET (LVnMOS) (5 V/0.6 μm), high-voltage n-channel MOSFET (HVnMOS), and high-voltage p-channel MOSFET (HVpMOS) (12 V/1.8 μm) devices under test (DUTs), respectively. After a series of systematic TLP measurements, this study determined that the set VLB level substantially influenced the failure mode identification and It2 value decision on the LVnMOS and HVnMOS DUTs, but its effect on the HVpMOS DUT was extremely weak. According to the secondary breakdown current (I t2) values, the error caused by a maximum VLB level was up to 55.6% in the LVnMOS DUT, 81% in the HVnMOS DUT, and only 3.38% in the HVpMOS DUT. Consequently, this engendered a considerable deviation in most data derived from testing DUTs through TLP compared with those derived from a human-body model (HBM). Hence, to ensure a high correlation between values measured through TLP testing ​​and an HBM for the same DUTs, the VLB level should be considered during TLP testing. The lack of correlation is demonstrated to be due to a moderate soft and hard failure during TLP measurement especially for the LVnMOS and HVnMOS samples. Therefore, to obtain accurate I t2 values for DUTs, the VLB level for the failure-mode identification in TLP testing should be within a low-biasing range (such as kept VLB ≤ 5 V).
机译:本文研究了漏偏电压(VLB)电平的影响,并将其设置为故障模式识别,以用于传输线脉冲(TLP)测试中的最终故障诊断测量。为了确定对静电放电(ESD)鲁棒性的影响,采用了三种类型的MOSFET组件。即,低压n沟道MOSFET(LVnMOS)(5 V / 0.6μm),高压n沟道MOSFET(HVnMOS)和高压p沟道MOSFET(HVpMOS)(12 V / 1.8μm)器件分别被测(DUT)。经过一系列系统的TLP测量后,该研究确定设定的VLB电平在很大程度上影响了LVnMOS和HVnMOS DUT的故障模式识别和It2值决策,但对HVpMOS DUT的影响极弱。根据二次击穿电流(I t2)值,由最大VLB电平引起的误差在LVnMOS DUT中高达55.6%,在HVnMOS DUT中高达81%,而在HVpMOS DUT中仅为3.38%。因此,与通过人体模型(HBM)得出的数据相比,通过TLP测试DUT得出的大多数数据存在很大的偏差。因此,为确保通过TLP测试测得的值与相同DUT的HBM之间具有高度相关性,在TLP测试期间应考虑VLB级别。事实证明,缺乏相关性是由于在TLP测量期间出现了中等程度的软性和硬性破坏,尤其是对于LVnMOS和HVnMOS样品而言。因此,为了获得DUT的准确I t2值,用于TLP测试中的故障模式识别的VLB电平应在低偏置范围内(例如保持VLB≤5 V)。

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