首页> 外文期刊>Industrial Laser Solutions >Printed circuit board processing with UV lasers
【24h】

Printed circuit board processing with UV lasers

机译:用紫外线激光器加工印刷电路板

获取原文
获取原文并翻译 | 示例
           

摘要

It is easy to dismiss a technology you can't see, but anyone working with circuit board applications would be mistaken to overlook ultraviolet lasers - one of the most versatile, efficient printed circuit board (PCB) processing technologies available. The beam from a laser generally provides a low-stress alternative to mechanical PCB processing methods such as milling or routing, but UV lasers provide an added benefit other laser sources do not, which is the ability to limit thermal stress. This is possible because most UV laser systems operate at low power levels. By utilizing a process sometimes known as "cold ablation," the beam from a UV laser produces a reduced heat-affected zone (HAZ) that minimizes burring, charring, and other negative effects of thermal stress normally associated with higher-powered lasers.
机译:很容易消除看不见的技术,但是从事电路板应用的任何人都会被误认为忽略了紫外线激光器-紫外线是最通用,最有效的印刷电路板(PCB)处理技术之一。激光束通常提供低应力替代机械PCB处理方法(例如铣削或铣削)的方法,但是UV激光提供了其他激光源无法提供的额外好处,那就是能够限制热应力。这是可能的,因为大多数UV激光系统都以低功率运行。通过利用有时被称为“冷烧蚀”的过程,来自紫外线激光器的光束会产生减小的热影响区(HAZ),从而将毛边,炭化以及通常与高功率激光器相关的热应力的其他负面影响降至最低。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号