KLA-Tencor has unveiled its latest defect management system designed to help chip manufacturers overcome the challenges associated with ramping their advanced lithography processes into production. Combining KLA-Tencor's defect management hardware and software tools, a new proprietary reticle design and optimised test wafers, MicroPCM offers fabs an efficient and cost-effective methodology that enables them to identify and eliminate lithography-related micro defects before product lots are placed at risk.
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