首页> 外文会议>International Conference on Solid-State and Integrated Circuit Technology(ICSICT-2006); 20061023-26; Shanghai(CN) >Photoluminescence Evaluation of Defects Generated during Temperature Ramp-up Process of SiGe-On-Insulator Virtual Substrate Fabrication
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Photoluminescence Evaluation of Defects Generated during Temperature Ramp-up Process of SiGe-On-Insulator Virtual Substrate Fabrication

机译:绝缘体上硅锗虚拟衬底制造过程中温度上升过程中产生的缺陷的光致发光评估。

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摘要

Defects generated during the temperature ramping process were evaluated by photoluminescence (PL) for Si/SiGe/Si-on-insulater structure, which is the typical structure for SiGe-on-insulator (SGOI) virtual substrate fabrication using the Ge condensation by dry oxidation. The free exciton peaks were clearly observed for the as grown wafers and decreased with the increase of annealing temperature. Defect-related PL signals at around 0.82, 0.88, 0.95 and 1.0 Ev were observed and they also varied according to the annealing temperature and SiGe thickness. The defect-related PL signals were also correlated to dislocation-related defects by transmission electron microscopy (TEM).
机译:通过光致发光(PL)评估了Si / SiGe /绝缘体上硅结构在温度上升过程中产生的缺陷,该结构是绝缘体上SiGe(SGOI)虚拟衬底制造的典型结构,该结构使用通过干法氧化Ge制备。随生长的晶片清楚地观察到自由激子峰,并随退火温度的升高而降低。观察到与缺陷相关的PL信号在0.82、0.88、0.95和1.0 Ev左右,并且它们也根据退火温度和SiGe厚度而变化。缺陷相关的PL信号还通过透射电子显微镜(TEM)与位错相关的缺陷相关。

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