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Variability Analysis of Stochastic Parameters on the Electrical Performance of On-Chip Current-Mode Interconnect System

机译:随机参数对片上电流模式互连系统电性能的变异性分析

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Current-mode signalling scheme is one of the prominent solutions for high-speed and high data rate communication in global on-chip interconnects. Advancements in nanofabrication processes and housing of billions of transistors on a single silicon chip have made process-induced variations in transistors and interconnects quite significant. Analysis of parameter variations has become an important step in predicting the reliability and addressing various electronic circuit design issues in nanoscale regimes. The present paper evaluates the stochastic parameters variability on the electrical performance of on-chip current-mode interconnect system. Both transistor and interconnect variability effects are analyzed. Interconnect is modelled by an equivalent distributed line model and is driven by a current-mode driver. The impact of variability is assessed via parametric, process corner and Monte-Carlo analyses. The variability analysis is carried out for single as well as coupled 2-Line, 3-Line and 5-Line interconnect structures. Furthermore, the impact of individual process parameter variability in current-mode interconnect system has been investigated using statistical techniques namely Taguchi design of simulation scheme, ANOVA and Rank table.
机译:电流模式信令方案是全球片上互连中高速和高数据速率通信的重要解决方案之一。纳米制造工艺的进步以及在单个硅芯片上容纳数十亿个晶体管的能力,使得晶体管和互连的工艺引起的变化非常显着。参数变化的分析已成为预测可靠性并解决纳米级方案中各种电子电路设计问题的重要步骤。本文评估了随机参数对片上电流模式互连系统电性能的变异性。分析了晶体管和互连的可变性影响。互连由等效的分布式线路模型建模,并由电流模式驱动器驱动。可变性的影响通过参数,过程角和蒙特卡洛分析进行评估。对单线以及耦合的2线,3线和5线互连结构进行了可变性分析。此外,已经使用统计技术(即Taguchi仿真方案设计,ANOVA和Rank表)研究了各个工艺参数可变性对电流模式互连系统的影响。

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