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Study of the DC Performance of Fabricated Magnetic Tunnel Junction Integrated on Back-End Metal Line of CMOS Circuits

机译:CMOS电路后端金属线上集成的磁隧道结的直流性能研究

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摘要

In this paper, we have succeeded in the fabrication of high performance Magnetic Tunnel Junction (MTJ) which is integrated in CMOS circuit with 4-Metal/1-poly Gate 0.14μm CMOS process. We have measured the DC characteristics of the MTJ that is fabricated on via metal of 3rd layer metal line. This MTJ of 60 × 180 nm~2 achieves a large change in resistance of 3.52 kΩ (anti-parallel) with TMR ratio of 151% at room temperature, which is large enough for sensing scheme of standard CMOS logic. Furthermore, the write current is 320 μA that can be driven by a standard MOS transistor. As the results, it is shown that the DC performance of our fabricated MTJ integrated in CMOS circuits is very good for our novel spin logic (MTJ-based logic) device.
机译:在本文中,我们成功地制造出了高性能的磁隧道结(MTJ),该器件通过4金属/ 1多晶硅栅极0.14μmCMOS工艺集成在CMOS电路中。我们已经测量了在第三层金属线的过孔金属上制造的MTJ的DC特性。在室温下,此MTJ为60×180 nm〜2,实现了3.52kΩ(反并联)的大电阻变化,TMR比为151%,对于标准CMOS逻辑的感应方案来说足够大。此外,可通过标准MOS晶体管驱动的写入电流为320μA。结果表明,对于新型的自旋逻辑(基于MTJ的逻辑)器件,我们集成在CMOS电路中的MTJ的制造直流性能非常好。

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