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Prediction of Circuit-Performance Variations from Technology Variations for Reliable 100 nm SOC Circuit Design

机译:从技术变化预测电路性能变化,以实现可靠的100 nm SOC电路设计

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摘要

The long-standing problem of predicting circuit performance variations without a huge number of statistical investigations is demonstrated to be solvable by a surface-potential-based MOSFET model. Direct connection of model parameters to physical device parameters reflecting process variations and the reduced number of model parameters are the enabling key model properties. It has been proven that the surface-potential-based model HiSIM2 is capable of reproducing measured I-V and its derivatives' variations with those of device/process related model parameters. When used to predict 51-stage ring oscillator frequency variation including both inter- and intra-chip variation, it reproduces measurements with shortened simulation time.
机译:无需大量统计研究即可预测电路性能变化的长期问题已被基于表面电位的MOSFET模型解决。模型参数与反映过程变化的物理设备参数的直接连接以及减少的模型参数数量是启用的关键模型属性。业已证明,基于表面电势的模型HiSIM2能够重现所测量的I-V及其导数与设备/过程相关模型参数的变化。当用于预测包括芯片间和芯片内变化在内的51级环形振荡器的频率变化时,它以较短的仿真时间再现了测量结果。

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